applications ? point-of-load modules ? multi-phase regulators ? voltage regulator module (vrm) ? desktop and server vrms and evrds ? data networking and storage systems ? notebook regulators ? graphics cards and battery power systems ? dcr current sensing environmental data ? storage temperature range: -40c to +125c ? operating temperature range: -40c to +125c (with derated current) ? solder reflow temperature: j-std-020d compliant packaging ? supplied in tape and reel packaging, 700 parts per 13? diameter reel halogen hf free pb description ? halogen free ? 125c maximum total temperature operation ? 10.3 x 8.1 x 6.65mm surface mount package ? ferrite core material ? secure 3 terminal mounting ? high current carrying capacity, low core losses ? controlled dcr tolerance for sensing circuits ? inductance range from 0.3h to 10.0h ? current range from 5.3 to 48 amps ? frequency range up to 1mhz ? rohs compliant high current, high frequency, power inductors hcf1007 series 1109 bu-sb091065 page 1 of 4 data sheet 4361 smd device 1 open circuit inductance (ocl) test parameters: 100khz, 0.10v rms , 0.0adc 2 full load inductance (fll) test parameters: 100khz, 0.1v rms ,i sat 1 3i rms : dc current for an approximate temperature rise of 40c without core loss. derating is necessary for ac currents. pcb layout, trace thickness and width, air-flow, and proximity of other heat generating components will affect the temperature rise. it is recommended that the temperature of the part not exceed 125c under worst case operating conditions verified in the end application. 4i sat 1: peak current for approximately 20% rolloff at +25c. 5i sat 2: peak current for approximately 20% rolloff at +125c. 6 k-factor: used to determine b p-p for core loss (see graph). b p-p = k * l * i. b p-p :(gauss), k: (k-factor from table), l: (inductance in h), i (peak-to-peak ripple current in amps). 7 part number definition:hcf1007-xxx-r ? hcf1007 = product code and size ? xxx= inductance value in h, r = decimal point. if no ?r? is present then third character =# of zeros ? -r suffix = rohs compliant product specifications ocl 1 fll 2 i rms 3 i sat 1 4 i sat 2 5 dcr m part number 7 h 10% min (h) amps amps @25c amps @125c @20c k-factor 6 hcf1007-r30-r 0.30 0.21 30 48 35 0.896% 279.9 hcf1007-r42-r 0.42 0.30 26 45 36 1.256% 186.6 hcf1007-r56-r 0.56 0.40 26 36 28 1.256% 186.6 hcf1007-r68-r 0.68 0.49 26 29 23 1.256% 186.6 hcf1007-1r0-r 1.0 0.72 16 26 21 2.656% 139.9 hcf1007-1r5-r 1.5 1.08 13 22 17 4.156% 112.0 hcf1007-2r2-r 2.2 1.57 10.7 18 14 6.356% 93.30 hcf1007-3r3-r 3.3 2.37 10 14.5 11 7.506% 79.97 HCF1007-4R7-R 4.7 3.38 9.4 12 8.9 8.656% 69.97 hcf1007-5r6-r 5.6 4.03 9.4 9.4 7.5 8.656% 69.97 hcf1007-6r8-r 6.8 4.90 9.4 7.8 6.1 8.656% 69.97 hcf1007-100-r 10.0 7.20 9.4 5.3 4.2 8.656% 69.97
s ection a -a a a 6.70 1.5 dia 1.5 dia 4.0 2.0 12.0 1.75 11.5 24.0 0.3 user direction of feed 1 2 10.50 8.20 hcf1007 wwllyy r xxx 1 2 hcf1007 wwllyy r 10.10 0.2 7.8 0.3 6.65 max 1.80 ref 6.0 0.5 12 2.3 0.3 8.60 3.61 3.0 xxx 2.9 2.0 3.6 2.4 0.3 1.3 0.3 4.2 0.5 1 2 2 1 top view side view bottom view recommended pad layout schematic test dcr at the bend points dimensions - mm part marking: coiltronics logo hcf1007 xxx = inductance value in h. (r = decimal point). if no ?r? is present, then last character is # of zeros yyllww = date code r = revision level supplied in tape-and-reel packaging, 700 parts per reel, 13? diameter reel. packaging information - mm 1109 bu-sb091065 page 2 of 4 data sheet 4361 temperature rise vs. total loss 0 10 20 30 40 50 60 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 total loss (w) temperature rise (c)
1109 bu-sb091065 page 2 of 4 data sheet 4361 core loss core loss vs. b 0.00001 0.0001 0.001 0.01 0.1 1 10 100 1000 10000 b (g au ss) core loss(w) 1mhz 500khz 300khz 200khz 100khz p-p p-p inductance characteristics % of ocl vs. % of i sat 1 0% 20% 40% 60% 80% 100% 0% 20% 40% 60% 80% 100% 120% 140% 160% % of i sat 1 % of ocl +25c -40c +125
? 2009 cooper bussmann st. louis, mo 63178 www.cooperbussmann.com 1109 bu-sb091065 page 4 of 4 data sheet 4361 the only controlled copy of this data sheet is the electronic read-only version located on the cooper bussmann network drive. a ll other copies of this document are by definition uncon- trolled. this bulletin is intended to clearly present comprehensive product data and provide technical information that will he lp the end user with design applications. cooper bussmann reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution o f any products. cooper bussmann also reserves the right to change or update, without notice, any technical information contained in this bulletin. once a product has been selected, it sh ould be tested by the user in all possible applications. life support policy: cooper bussmann does not authorize the use of any of its products for use in life support devices or syste ms without the express written approval of an officer of the company. life support systems are devices which support or sustain life, and whose failure to perform, when properly used in ac cordance with instructions for use provided in the label- ing, can be reasonably expected to result in significant injury to the user. north america cooper electronic technologies 1225 broken sound parkway nw suite f boca raton, fl 33487-3533 tel: 1-561-998-4100 fax: 1-561-241-6640 toll free: 1-888-414-2645 cooper bussmann p.o. box 14460 st. louis, mo 63178-4460 tel: 1-636-394-2877 fax: 1-636-527-1607 europe cooper electronic technologies cooper (uk) limited burton-on-the-wolds leicestershire ? le12 5th uk tel: +44 (0) 1509 882 737 fax: +44 (0) 1509 882 786 cooper electronic technologies avda. santa eulalia, 290 08223 terrassa, (barcelona), spain tel: +34 937 362 812 +34 937 362 813 fax: +34 937 362 719 asia pacific cooper electronic technologies 1 jalan kilang timor #06-01 pacific tech centre singapore 159303 tel: +65 278 6151 fax: +65 270 4160 solder reflow profile temperature t t p t s t c -5c time 25c to peak time 25c t smin t smax t l t p preheat a max. ramp up rate = 3c/s max. ramp down rate = 6c/s t t a a b b l l e e 1 1 - - s s t t a a n n d d a a r r d d s s n n p p b b s s o o l l d d e e r r ( ( t t c c ) ) volume volume package mm 3 mm 3 thickness <350 > _ 350 <2.5mm 235 c 220 c > _ 2.5mm 220 c 220 c t t a a b b l l e e 2 2 - - l l e e a a d d ( ( p p b b ) ) f f r r e e e e s s o o l l d d e e r r ( ( t t c c ) ) volume volume volume package mm 3 mm 3 mm 3 thickness <350 350 - 2000 >2000 <1. 6 mm 2 6 0 c 2 6 0 c 2 6 0 c 1. 6 ? 2.5mm 2 6 0 c 250 c 245 c >2.5mm 250 c 245 c 245 c reference jdec j-std-020d profile feature standard snpb solder lead (pb) free solder pr e h ea t a n d s o a k? t e mp e r a tur e min. (t smin ) 100 c 150 c ? t e mp e r a tur e m a x. (t sm a x ) 150 c 200 c ? tim e (t smin to t sm a x ) (t s ) 6 0-120 se con d s 6 0-120 se con d s av e r a g e r a mp up r a t e t sm a x to t p 3 c / se con d m a x. 3 c / se con d m a x. liqui d ous t e mp e r a tur e (t l ) 183 c 217 c tim e a t liqui d ous (t l ) 6 0-150 se con d s 6 0-150 se con d s p ea k p a ck a g e b o d y t e mp e r a tur e (t p ) * t ab l e 1t ab l e 2 tim e (t p ) ** within 5 c of th e sp e cifi ed cl a ssific a tion t e mp e r a tur e (t c ) 20 se con d s ** 30 se con d s ** av e r a g e r a mp- d own r a t e (t p to t sm a x ) 6 c / se con d m a x. 6 c / se con d m a x. tim e 25 c to p ea k t e mp e r a tur e6 minut e s m a x. 8 minut e s m a x. * tol e r a nc e for p ea k profil e t e mp e r a tur e (t p ) is de fin ed a s a suppli e r minimum a n d a us e r m a ximum. ** tol e r a nc e for tim e a t p ea k profil e t e mp e r a tur e (t p ) is de fin ed a s a suppli e r minimum a n d a us e r m a ximum.
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